ICT |TDK at a Glance for Investors｜tdk_at_a_glance

ICT

The wave of digital transformation (DX) is surging across various areas of the ICT society. As a result of the proliferation of 5G communications and the Internet of Things (IoT), the amount of information circulated on a daily basis is growing explosively. In response to these developments, traditional cloud computing, which processes information in bulk at data centers, is shifting to edge computing, where distributed processing is performed at a location close to the user’s terminal. TDK’s highly varied and extensive lineup of electronic components and devices support the new network society.

Supporting the New Network Society

Multilayer ceramic chip capacitors (MLCCs)
Camera modules
Magnetic heads for hard disk drives (HDDs)
Multilayer chip inductors
Piezo speakers
Flash storages
Power inductors
Haptic devices
Distributed power supply systems
Batteries
High-frequency components
Ultrasonic sensors
MEMS microphones
Multilayer chip varistors
Motion sensors
Wireless power transfer coils
Noise suppression sheets
Biological sensors

Supporting ICT Life in the 5G Era

Smartphones

Promoting Comfortable Mobile Lifestyles

Lithium ion batteries

TDK’s lithium ion batteries boast the top share of the global market for batteries installed in smartphones. They are also used in IoT devices, wearable devices, and various other devices.
Circuit protection Devices

Mobile devices, which are often carried and operated by hand, are at risk of problems and malfunctioning caused by electrostatic discharges from the human body. Chip varistors are often used to protect IC circuits and the like from intruding surges.

Wearable Devices

Miniaturization and Weight-Reducing Innovations

SESUB

The Semiconductor Embedded in SUBstrate (SESUB) is a proprietary TDK multilayer substrate technology that embeds thinned IC chips to substrates. It makes possible optimal, ultracompact modules such as power supply modules and communications modules for IoT devices and wearable devices.

AR/VR Devices

Expansion into Business, Educational, and Medical Fields

MEMS ultrasonic sensors

Time-of-flight (ToF) type compact ultrasonic sensors that have been miniaturized using MEMS technology. They are used as distance measuring sensors and also integrated into AR/VR devices with transmitting and receiving ultrasonic waves.
PiezoHapt^™/PowerHap^™

Actuators that create virtual tactile sensations through vibration patterns using piezoelectric elements.

Supporting the Use of Big Data and AI

Data Centers/Servers

Responding to Rapidly
Increasing Data Volumes
Magnetic heads for large-capacity HDDs

Magnetic heads for hard disk drives (HDDs) manufactured using thin-f ilm processing technology. Multiple magnetic heads are used in each of the nearline HDDs in data center servers. We are currently developing microwave assisted magnetic recording (MAMR) and heat assisted magnetic recording (HAMR) for next-generation, high-capacity HDDs.
Contributing to Easy Design with
Miniaturization and
Higher Performance
μPOL^™

Ultra-compact DC-DC conver ters with chip components such as power inductors mounted on a TDK proprietary SESUB. They are ideal for use as POL conver ters in the f inal stage of distributed power supply systems.

5G Communication Small Base Stations

Supporting Edge Computing
Flash Storage

Flash storage for industrial and embedded applications including industrial SSDs and industrial SD memory cards. Flash storage is characterized by high data reliability and durability, and it is used in communication base stations, communication broadcasting equipment, information system equipment, and more.
Communication Antennas
that Achieve Multiple Simultaneous
Connections
LTCC chip antennas

5G communication small cell base stations use distinctive multi-antennas that incorporate multiple antenna elements. TDK’s LTCC AiP devices are advanced chip antennas that integrate antenna elements and high-frequency components and other components with low temperature co-fired ceramics (LTCC).