TDK announces it won the IEC-APC Chair’s Award

• TDK announced that Hideyuki Nagai has received the IEC-APC Chair’s Award, which recognizes outstanding contributions to IEC international standardization activities in electrical and electronic technology.
• Led the development of IEC standards originating in Japan and international standardization activities related to electronic assembly technology as convenor of IEC/TC91 WG3
• Contributed to international standardization of highly reliable electronic assembly technology that supports growth regions within the AI ecosystem

TDK Corporation (TSE:6762) announces that TDK has won the IEC-APC Chair’s Award for the first time from the International Electrotechnical Commission Activities Promotion Committee (IEC-APC). This organization promotes the activities of International Electrotechnical Commission (IEC), which develops and revises international standards in the field of electrical and electronic technology. The IEC-APC Chair's Award is presented to experts who have made outstanding contributions to IEC international standardization activities in the field of electrical and electronic technology.

This award was given to Hideyuki Nagai, Section-Head, Reliability Technology Section, Evaluation Department, Quality Assurance Group, Quality Assurance Headquarters, TDK Corporation. His leadership as convenor of WG3 (working group responsible for deliberating on the development of IEC standards for electronic assembly testing methods) within IEC/TC91, which is engaged in international standardization activities for electronic assembly technology at IEC. He has been highly commended for spearheading discussions and coordinating opinions with international experts, thereby continuously advancing the development of IEC standards originating in Japan and promoting international standardization efforts.

Through its participation in IEC international standardization activities, TDK contributes not only to improving the quality and reliability of electronic mounting components, but also to establishing a common evaluation framework in the global market and strengthening international competitiveness in the field of electronic mounting technology. Furthermore, this award follows our receipt of the IEC 1906 Award last year and reflects high recognition of our ongoing commitment to international standardization activities.

"We are deeply honored to have received the IEC-APC Chair’s Award. We are very pleased to have contributed to the development of IEC standards originating in Japan and to the advancement of electronic assembly technology through my participation in international standardization activities within IEC/TC91 WG3. We believe that international standardization efforts serve as a vital foundation for the safe and widespread use of electronic assembly technologies worldwide, and that these efforts also contribute to improving the quality and reliability of electronic assembly components. We would like to express our heartfelt gratitude to all members of IEC/TC91, as well as to all stakeholders both within and outside our organization, for their continued supports,” said Nagai.

As the AI ecosystem continues to expand, electronic devices are required to become even smaller and more powerful, leading to an increasing demand for the highly reliable electronic assembly technology that forms the foundation of these devices. TDK will continue to promote international standardization activities in the electronic assembly field through the development of IEC standards originating in Japan, such as those of IEC/TC91, thereby contributing to the advancement of electronic assembly technology and the improvement of the quality and reliability of next-generation electronic devices.