Exhibitions: TDK to showcase latest solutions for AI ecosystem under the tagline “In Everything, Better” at electronica Shanghai 2026

TDK Corporation (TSE: 6762) announced that it will exhibit its latest solutions under its new brand identity and tagline “In Everything, Better” at electronica Shanghai , taking place from July 1 to 3, 2026 in Shanghai. TDK will showcase a comprehensive lineup of innovative products, and system-level solutions tailored for the AI ecosystem including solutions for Automotive, Information and Communication Technology (ICT), and industrial/energy fields.

Leveraging its long-standing expertise in materials science, passive components, sensors, power supplies, magnetic technologies, software, and AI, TDK will present its cutting-edge solutions in an integrated way. TDK aims to help customers build more efficient, reliable, and sustainable next-generation electronic systems, empowering customers to realize “In Everything, Better.”

For AI and Physical AI: Connecting Digital Intelligence with the Real World

AI is rapidly moving from the cloud to the edge and into the physical world. TDK will showcase a comprehensive range of solutions for Physical AI, smart glasses, XR/AR/VR, human-machine interfaces, and intelligent sensing. With TDK’s advanced smart glasses technologies, customers can create intelligent end-user devices capable of capturing their surroundings to deliver instant generative AI insights.

In the realm of human-machine interaction, TDK will present cutting-edge haptic feedback and control technologies. The showcase features haptic touch-based zoom control, an immersive haptic glove experience, and motion-aware IMU solutions, helping XR/AR/VR, smart glasses, and wearables achieve a more natural and intuitive interactive experience.

For embodied robotics, high-precision and ultra-reliable sensors are indispensable. TDK will exhibit ultra-small TMR sensors, advanced MEMS IMUs serving as the "inner ear" for humanoid robots, and NTC temperature sensors engineered for precise thermal measurement.

Furthermore, in the field of Industrial AI, TDK will highlight its edge-intelligence-driven condition monitoring and predictive maintenance solutions. By combining industrial domain expertise with lightweight, edge-optimized machine learning models, this intelligent expert system enables ultra-low-latency AI inference at the edge. It captures micro-vibrations and thermal anomalies across the entire system, identifying latent faults imperceptible to humans. Operating as a 24/7 online digital operations brain, the solution helps identify anomalies early, minimizes unplanned downtime, and continuously maximizes equipment uptime and factory efficiency.

TDK’s compact ultrasonic sensor module seamlessly integrates a transducer, driver, and signal processor into an ultra-compact package. Equipped with mechanically isolated decoupling elements and exceptional EMC characteristics, this design transforms the module into a robust, versatile component optimized for challenging environments.

From Grid to Core: Supporting High-Density Power Supply for AI Data Centers

To address the rapidly growing computing and power demands of AI data centers, TDK proposes a systematic “From grid to core” approach. The solutions cover critical sub-applications, including AI server power supply units (PSUs), uninterruptible power supplies (UPS), battery energy storage systems (BESS), solid-state transformers (SST), and point-of-load (POL) power delivery next to the processor.

Featured exhibits include ultra-compact aluminum electrolytic snap-in capacitors, MKP DC-link film capacitors, and SMD NTC thermistors. Additionally, TDK will showcase a partner’s 12 kW high-power-density, high-frequency AI server PSU reference design enabled by TDK’s advanced components.

Automotive Electronics: Supporting Electrification, Intelligence, and Upgraded Cabin Experiences

Supporting the advancement of smart and electric mobility, TDK will showcase a comprehensive portfolio spanning electric drive systems, batteries, charging, thermal management, safety control, and smart cockpits. The lineup features customized CeraLink capacitors, CarXield EMC filters, magnetic components for battery management systems (BMS), and InsuGate transformers. Additionally, TDK will highlight its advanced sensor technologies—including temperature, pressure, current, Hall, and TMR magnetic sensors—engineered for precise environmental detection and vehicle stability control.

Demonstrations also include stray-field robust Hall and TMR position sensors for braking and thermal management, alongside next-generation MEMS IMUs for headlight leveling and stability control.

Industrial and Energy: Improving the Efficiency and Reliability of High-Power Systems

For the industrial, energy, and infrastructure markets, TDK will focus on EV fast-charging and power supply solutions. Key exhibits include film capacitors, input protection devices, high-voltage contactors, AC-DC / AC-AC power supplies, DC-DC power modules, and more.

ICT and Smart Terminals: Enabling Smaller, More Energy-Efficient, and Smarter Designs

For smartphones, IoT devices, TWS earbuds, gaming peripherals, wearables, and assistive technology applications, TDK will showcase high-precision TMR sensors for gaming peripherals, ultra-low-power MEMS microphones for keyboards and acoustic detection, and application solutions that improve ease of use by combining ToF sensing technology, motion sensors, and MEMS microphones.

EMC and System Engineering Services to Support the Development of Complex Electronic Systems

As automotive, industrial, AI data center, and high-power systems move toward higher frequencies, higher voltages, and greater integration, electromagnetic compatibility design is becoming increasingly critical. TDK will showcase its EMC solutions and introduce its engineering support and EMC testing service capabilities at the Shanghai C-PAC EMC Laboratory, to provide customers with EMC testing and remediation countermeasure recommendations.

We cordially invite you to visit the TDK booth at electronica Shanghai 2026 (Booth No. N1-205) to explore our comprehensive portfolio. Come discover how TDK brings “In Everything, Better” to life—enabling and empowering a smarter, more efficient, and more sustainable future from within.