News Center | Press Releases

TDK Develops BGA Chip Varistor with EMI Filter Function

Information contained in the news releases are current as of the date of the press announcement, but may be subject to change without prior notice.

One chip contains 30 elements, can be used to create 10-line arrays

TDK Develops BGA Chip Varistor with EMI Filter Function
TDK Develops BGA Chip Varistor with EMI Filter Function

Mar. 23, 2009

TDK Corporation announced today that it has developed the AVF26BA12A400R201 BGA* chip varistor (2.6 mm × 2.6 mm × 0.65 mm) with an electromagnetic interference (EMI) filter function. Mass production is scheduled to begin in October.

Mobile electronic devices such as mobile phones have steadily become smaller while incorporating more advanced functions in recent years, and as a result, further miniaturization and integration of the electronic components used in them are necessary. In addition, the use of lower IC operating voltages is accelerating to maintain and lengthen device operating times by limiting power consumption. This means the creation of environments that are even more susceptible to effects from high-voltage static electricity, and as a result, electrostatic discharge (ESD) countermeasures to prevent malfunction of devices and damage to their components are essential.

TDK responded to this market needs by developing a chip varistor with a BGA-type terminal suitable for mounting in compact mobile devices. To provide a single chip with as much capacity as possible, each chip contains 30 elements and can be used to create 10-line ESD countermeasures. As a result, the mounting area of this product is 33% less than earlier TDK products.

In addition, the new varistor has a filter function to control EMI generated by devices. This makes the installation of separate EMI countermeasures components unnecessary and contributes to a further reduction of mounting area.

Glossary
BGA: Abbreviation for ball grid array. Refers to an array of ball electrodes made from solder.
No lead wires extend from the component, resulting in a smaller mounting area.
Main Features
  1. Terminal electrodes are BGA type, contributing to a reduction in mounting area
    (approximately 33% less than earlier TDK products).
  2. One chip contains 30 elements, and 10-line ESD countermeasures are possible.
  3. Includes EMI filter function.
Main Characteristics
Varistor voltage 12 V
Capacitance value at 1 MHz 40 pF
Dimensions 2.6 mm × 2.6 mm × 0.65 mm
Main Applications
Mobile phones, portable music players, digital video cameras, digital still cameras, etc.
Production and Sales Plan
  • Production location: Japan
  • Production capacity: 10 million units/month
  • Start of production: October 2009

For further information, contact the Corporate Communications Dept.
Tel.: 81-3-6778-1055
E-mail: TDK.PR@tdk.com