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EMC components: Miniaturized thin-film common-mode filter for high-speed interfaces

  • Common-mode attenuation of 27.5 dB at 850 MHz
  • Footprint nearly 60 percent smaller than existing products with same common-mode attenuation
EMC components: Miniaturized thin-film common-mode filter for high-speed interfaces

May. 14, 2015

TDK Corporation has expanded its lineup of common-mode filters. The new TCM0403R thin-film common-mode filter offers a common-mode attenuation of 27.5 dB at 850 MHz in a 0403 package (0.45 mm x 0.30 mm), the world’s highest value for this case size. The footprint of the TCM0403R is nearly 60 percent smaller than the existing TCM0605R with same common-mode attenuation. In addition, the new filter features an extremely low insertion height of only 0.23 mm. With a cutoff frequency of 5.0 GHz and good common-mode attenuation characteristics in 500 MHz to 2.4 GHz range, the new filter suppresses common-mode noise without distorting high-speed differential signals. It is thus compatible with various high-speed interfaces such as MIPI, USB 2.0, and USB 3.0. The typical DC resistance is 3.5 Ω. As a result, the new TCM0403R thin-film common-mode filter significantly improves the WLAN reception sensitivity in smartphones, conventional mobile phones and other compact portable devices. Mass production began in May 2015.

The miniaturization was realized using TDK’s leading-edge thin-film patterning technology that it developed through HDD magnetic head manufacturing combined with compact, high-precision coil pattern and terminal formation processes. Thanks to its much smaller footprint, the new filter supports the high-density mounting of electronic components and contributes to significant space-savings in electronic devices.


Glossary
  • MIPI: the Mobile Industry Processor Interface is an open standard supported by the MIPI Alliance, which consists of nearly 200 members companies in the mobile device industry.
Main applications
  • Smartphones, conventional mobile phones, and other mobile devices
  • Electronic devices with high-speed interfaces such as MIPI, USB 2.0, and USB 3.0
Main features and benefits
  • High 5.0 GHz cutoff frequency for compatibility with high-speed interfaces
  • Good common-mode attenuation characteristics in 500 MHz to 2.4 GHz range for improved mobile signal reception sensitivity; common-mode attenuation of 27.5 dB at 850 MHz
  • Significant size reduction, combined with typical DC resistance of 3.5 Ω
Key data
TypeDimensions
[mm]
Common-mode
attenuation [dB] typ. @ 850 MHz
Cutoff frequency [GHz] typ.DC resistance [Ω] typ.
TCM0403R-900-2P 0.45 x 0.30 x 0.23 27.5 5.0 3.5
About TDK Corporation

TDK Corporation is a leading electronics company based in Tokyo, Japan. It was established in 1935 to commercialize ferrite, a key material in electronic and magnetic products. TDK's portfolio includes electronic components, modules and systems* marketed under the product brands TDK and EPCOS, power supplies, magnetic application products as well as energy devices, flash memory application devices, and others. TDK focuses on demanding markets in the areas of information and communication technology and consumer, automotive and industrial electronics. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. In fiscal 2015, TDK posted total sales of USD 9.0 billion and employed about 88,000 people worldwide.

  • * The product portfolio includes ceramic, aluminum electrolytic and film capacitors, ferrites, inductors, high-frequency components such as surface acoustic wave (SAW) filter products and modules, piezo and protection components, and sensors.

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Contacts for regional media
RegionContactPhoneMail
Japan Mr. Akira TESHIMA TDK Corporation
Tokyo, Japan
+813 6778-1055 pr@jp.tdk.com
ASEAN Ms. Jiang MAN
Mr. Shota KANZAKI
TDK Singapore (Pte) Ltd.Singapore +65 6273 5022 asean.inquiry@sg.tdk.com
Greater China Ms. Clover XU TDK China Co., Ltd.
Shanghai, China
+86 21 61962307 pr@cn.tdk.com
Europe Mr. Frank TRAMPNAU TDK Europe GmbH
Duesseldorf, Germany
+49 211 9077 127 frank.trampnau@eu.tdk.com
America Ms. Sara M. LAMBETH TDK Corporation of America
Irving, TX, USA
+1-972-409-4519 sara.lambeth@us.tdk.com

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